| 摘要 |
PURPOSE:To realize a semiconductor element capable of easy replacement or assembly and to enable a cooling process to be accomplished most efficiently by a method wherein the part of a spiral, metal, square pipe to be in contact with a semiconductor element is formed inseparably and the circumferential portion of the same not to be in contact with said element is not formed inseparably. CONSTITUTION:A cooling unit 1 is constituted of a flow-in path 13 and flow-out path 14 for a coolant. The flow-in path 13 and flow-out path 14 are built of a metal pipe 12 (of a rectangular cross section in this case) composed of such a metal as copper or aluminum, which is excellent in heat transmission, formed into a spiral with a center 15. In a contact area 16 of phiD in the cooling unit 1 to be in contact with a semiconductor element, the neighboring pipe sections are tightly soldered together for example with silver solder, and the pipe sections along the outer circumference of the cooling unit 1 not to be in contact with the semiconductor element are allowed to remain not soldered together.
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