发明名称 |
Blanket tungsten deposition for dielectric |
摘要 |
A process is disclosed for depositing tungsten non-selectively on conductors and dielectrics without the use of an adhesive interlayer. The process comprises an argon pre-treatment followed by low power plasma deposition to nucleate the tungsten. A thick, adherent layer of tungsten is then deposited.
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申请公布号 |
US4777061(A) |
申请公布日期 |
1988.10.11 |
申请号 |
US19870132739 |
申请日期 |
1987.12.14 |
申请人 |
SPECTRUM CVD, INC. |
发明人 |
WU, SCHYI-YI;PRICE, J. B.;MENDONCA, JOHN;CHOW, YU CHANG |
分类号 |
C23C16/14;C23C16/50;(IPC1-7):B05D3/06 |
主分类号 |
C23C16/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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