| 摘要 |
A plurality of heat pipes extend longitudinally through a unitary or segmented circuit card module, terminating at both ends in cavities formed along lateral edges of the module. In one embodiment, bellows extend outwardly from the cavities in a direction normal to the plane of the module, terminating in interface plates which extends along the respective lateral edges of the module. In another embodiment, upstanding pillars are connected to bellows covering the cavities. Electronic components are mounted on a circuit card applied to a face of the module. The module is loosely received between opposed liquid cooled surfaces of guiderails in a circuit card rack. Heat from the components is communicated through the card to the heat pipes, increasing the pressure within the pipes to urge the interface plates or pillars into variable pressure contact with the guiderails. The pressure is sufficient to snugly hold the module in the rack. The thermal resistance between the interface plates or pillars and the guiderails varies as a function of the contact pressure, providing fast warm-up and lower operating temperatures for the components.
|
