| 摘要 |
<p>PURPOSE:To execute a probe inspection irrespective of the distance of an electrode interval by electrically connecting a pellet electrode and an inspecting electrode through a diode formed on a semiconductor substrate. CONSTITUTION:A semiconductor substrate 12 for forming a mother chip is formed of N type, a P<+> type region 16 is formed under a bump electrode 8, and a diode is formed between the region 16 and the substrate 12. The region 16 is electrically connected through the hole of an insulating film 13 to wirings 14. As a result, it is electrically connected to the electrode 8. An inspecting electrode 17 made of aluminum exclusively used for inspecting with a probe is formed on the upper surface of the chip 5, and ohmically connected to an N<+> type region 18 through the hole of the film 13 thereunder. Accordingly, a bonding pad 10 and the electrode 17 are electrically connected through a diode formed under the electrode 8. The chip 5 is formed by lithography technique.</p> |
