| 摘要 |
PURPOSE:To efficiently cool an LSI element by mounting bellows made of shape memory alloy and filled with a substance having excellent specific heat and high thermal conductivity to be thermally elongated at the surface of a semiconductor element on a printed substrate, and disposing a cold plate having a cooling refrigerant above the bellows. CONSTITUTION:An LSI element 2 on a printed substrate 1 generates a large quantity of heat during its operation, the heat is transmitted on the element 2 to bellows 3 to raise the temperature of the bellows 3. When the temperature of the bellows 3 arrives at a predetermined value, the bellows 3 of shape memory alloy are recovered to its original shape, and its upper surface is contacted with the lower surface of a cold plate 4. When the bellows 3 are contacted with the plate 4, the heat in the bellows 3 is transmitted to the plate 4, and heat transmitted to the plate 4 is cooled by refrigerant 6 in the plate 4. Thus, the cooling effect of the element 2 is improved.
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