| 摘要 |
PURPOSE:To cope with the increase of leads by a method wherein an insulator frame adheres to external periphery of the island for semiconductor element while a lead frame provided with a groove between frame and element is utilized. CONSTITUTION:A semiconductor pellet 1 is soldered 3 on an island 2 and the solder is prevented from flowing out by a groove 10. Next an insulator frame 9 adheres to the island 2 by soldering process. In such a constitution, wire is elongated in stabilized wire loop made supported by the frame 9, thereby wire bonding with high reliability may be assured coping with the increase of leads. |
