| 摘要 |
PURPOSE:To obtain a composition, consisting of a photo-setting polybutadiene based resin having a specific molecular weight, reactive monomer and photopolymerization initiator, having excellent heat cycle properties without requiring use of a buffer coating material and used for sealing electronic parts, etc. CONSTITUTION:A composition consisting of a photo-setting polybutadiene based resin having 500-10,000mol.wt., a reactive monomer (e.g. benzyl methacrylate or dicyclopentenyloxyethyl acrylate) in an amount of 20-230pts.wt. based on 100pts.wt. above-mentioned resin and a photopolymerization initiator (e.g. benzil, benzoin isobutyl ether or 2-methylthioxanthone) in an amount of normally 0.05-10pts.wt. based on 100pts.wt. afore-mentioned resin. Cracking can be prevented in heat cycle tests by flexibility of the polybutadiene based resin.
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