| 摘要 |
PURPOSE:To reduce the scribing, and decrease the thermal influence on an element to increase the reliability, by scribing a first electrode in a specified shape utilizing the energy distribution of an energy beam on an element surface. CONSTITUTION:A first electrode 2 is formed on a glass substrate 1. By applying a rectangular energy beam, the first electrode 2 is scribed, and a contact part 30 and a protruding part 50 are formed. A semiconductor layer 3 is formed on the first cut electrode 2. By an energy beam having uniform energy density, the semiconductor layer 3 and a part of the first electrode 2 are cut. By a method such as an oblique deposition, a second electrode 45 is formed. By using the protruding part 50 formed by cutting with the rectangular energy beam, the scribing process is reduced, and the thermal influence on an element is decreased.
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