发明名称 METHOD AND APPARATUS FOR PREPARING LID WITH OPENING PIECE
摘要 <p>PURPOSE:To prevent the generation of opening inferiority, by a method wherein the inner surface of an opening piece contacted at the orifice part of a lid material and the outer surface of the thermoplastic resin layer formed to the inner surface of the lid material are partially bonded under relatively high pressure and, thereafter, the entire inner surface of the opening piece and the outer surface of the lid material are bonded so as to leave a tab part. CONSTITUTION:In a primary bonding apparatus 3, the protruded part 17 of a seal head 9 presses the outer surface (a b-place) of an openng piece 2 nearer to a tab part 21 and the polyethylene 22 provided to the inner surface of the opening piece 2 and the OP varnish 30 provided to the outer surface of a lid material 2 are bonded in the range of an oblique line part while the inner surface of the opening piece 2 and the polyethylene 19 provided to the inner surface of the lid material 1 are bonded at the place C of an orifice 20. In a secondary bonding apparatus 4, a seal head 13 presses the lid material 1 and the opening piece 2 so that the Teflon tape 26 on a seal receiving table 14 and the primarily bonded place (c) are not superposed and the polyethylene 22 provided to the inner surface of the opening piece 2 and the polyethylene 19 provided to the inner surface of the lid material 1 are bonded in a range (e).</p>
申请公布号 JPS59106930(A) 申请公布日期 1984.06.20
申请号 JP19820218124 申请日期 1982.12.13
申请人 TOPPAN INSATSU KK;KIRIN BEER KK 发明人 ITOU SACHINORI;HIRAYAMA TAKAHISA;TAKE YOSHIAKI;HORINO MORIKATSU
分类号 B29C65/00;B29C53/00;B29C61/00;B29C63/00;B29C65/20;B29C65/78;B29D99/00;B29L9/00;B65D17/50 主分类号 B29C65/00
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