| 摘要 |
PURPOSE:To obtain measured result having high accuracy and to shorten measuring time by measuring machining accuracy by using a laser beam machining apparatus providing a focusing means for beam machining and a measuring means at the machining position. CONSTITUTION:The laser beam radiated from a laser beam source 1 for machining changes its intensity by a variable attenuator 2 and is projected on the opening 9 by a lens 3 through a mirror 4 and image of the opening 9 is projected as reducing on a wafer W by an objective lens 12. And, at the same time of putting a movable mirror 5 at the prescribed position, the beam from a light guide 7 is illuminated on the opening plate 9 by a condenser lens 8 and the image of the opening 9a is projected as reducing on the wafer W by the objective lens 12. The projecting position is the same as the laser irradiating position. That is, the detecting center on a stage ST in laser irradiating position measuring system for machining can coincide with the laser irradiating position center on the stage ST in the laser irradiating system for working. |
