| 摘要 |
PURPOSE:To decrease remaining burr between leads and to decrease defects due to the burr in the next step, by providing a buffer member between punches and the burr when cracks are yielded in the burr by a first means. CONSTITUTION:A molded IC lead frame 2 is sent to a first stage, which is a first means for yielding cracks in burr 3. Resin punches 4 and a buffer member 6 are lowered so as to push the IC lead frame 2, and the cracks are yielded in the burr 3 between leads. The frame is sent to a second stage, which is a second means, and ordinary deburring is performed. Then the cracks can be yielded with shocks imparted to the part of the burr 3 being alleviated with the buffering action of the member 6. Thus the remaining burr between the leads is decreased, and the defects due to the burr in the next step is decreased. |
