| 摘要 |
<p>PURPOSE:To contain a large chip in a small package at a distance between the end of the chip and the end of the package 1mm or shorter by composing it of the chip having a bonding pad, leads connected by gang bonding to the pad, and resin for sealing the chip. CONSTITUTION:Tabs for placing chips are eliminated at Ni/Sn-plated Cu-lead frames 1, and the ends of the frames 1 directed toward the interior of a package are all concentrated at the short side of the chips 2. The tip ends of the frames 1 are stepwisely formed in a gull-wing shape, and gang bonded simultaneously by a bonding pad 3 with gold bump and a TAB inner bonder of a hot press disposed at two short sides of the chip to be bonded. Thus, since it employs a structure in which only the ends of the chips are bonded, a distance between the end of the chip and the end of the package is set to 1mm or shorter.</p> |
