Semiconductor chip carriers

摘要

A chip carrier 34 is formed of a thermoplastics film material 32 to which is applied a pattern of electrically conductive material 31. The patterned film material is hot formed into a blister shape with the conductive pattern elements 31 extending down into the recess formed by the blister. In use, a semiconductor chip is carried against the internal face of the recess of the carrier and has lead outs connecting to the conductive pattern 31. A metal stud 40 may be moulded in position on the outer face of the blister by means of a moulded block of insulating material 39. The stud 40 then enables the carrier to be secured to a mounting bracket 42 so as to provide heat sink for the semiconducting chip mounted in the carrier.