| 摘要 |
PURPOSE:To eliminate bonding wires and a wire bonding process and reduce the area of a semiconductor chip by a method wherein outer terminals on the side surfaces of the semiconductor chip are contacted with inner terminals of the leads on the side surfaces of the recess of a package in which the chip is housed. CONSTITUTION:If a semiconductor chip 1 is inserted into the recess 7 of a package 6 to contact the respective wiring terminals 3 of the chip 1 with the leads 8 and 9 of the package 6 on the side surfaces of the chip 1 in such a manner that no gap exists between the chip 1 and the package 6, the conductive layers 3 on the side surfaces of the chip 1 and the conductive layers 8 and 9 on the side surfaces of the recess 7 are tightly contacted with each other and electrical connection can be obtained. With this constitution, wire bonding between the chip and package can be eliminated so that simplification and automation of packaging can be realized.
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