发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To control the bend of a loop, by pressing down a tool, putting a wire between the tool and a bonding part, rolling the wire and twisting it. CONSTITUTION:A wire 6 is put between an external lead terminal 9 and the bottom side of a capillary 22 by pressing the capillary 22, and is rolled in the direction of an arrow B on the terminal 9 by transferring the capillary 22. One end of a loop 21 is twisted, and its curl is eliminated. Thus a loop 23 is obtained, bend control of which is finished. Then a second supersonic thermal compression bonding is applied, and the wire is cut. By this constitution, defects due to loop contact can be avoided.
申请公布号 JPS63228724(A) 申请公布日期 1988.09.22
申请号 JP19870063006 申请日期 1987.03.18
申请人 FUJITSU LTD 发明人 MORIYA SUSUMU
分类号 H01L21/60 主分类号 H01L21/60
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