发明名称 BIASED GRINDING ASSEMBLY
摘要 <p>A grinding assembly (260) for grinding an object such as a printed circuit board coupon (266) at a predetermined angle and to a predetermined grinding depth, including a control board (264) carrying a grinding guide (262) having at least two conductive leads (312), (314) and a conductive control track (304) interconnecting the conductive leads, and a shelf (270) having an upper surface for supporting the object. The shelf (270) is positioned relative to the control board (264) to establish a grinding surface for the object biased at the predetermined angle. The shelf (270) is further positioned to align the predetermined grinding depth of the object with a portion of the rear edge (336) of the control track (304) so that the track is ground through when the object is ground along the biased grinding surface to the predetermined grinding depth.</p>
申请公布号 WO1988006952(A1) 申请公布日期 1988.09.22
申请号 US1987003421 申请日期 1987.12.24
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