| 摘要 |
PURPOSE:To prevent an LSI chip from damaging and to improve the yield by reducing the sizes of a pressurizing tool and a base to smaller than that of the chip, and further using a pressurizing tool having a protrusion only at the electrode of the chip and a base when the size of the chip is large. CONSTITUTION:A base 1 and a pressurizing tool 7 have protrusions at the parts corresponding to the bump electrodes 6 of an LSI chip 5. Or, when the chip size is small, it does not have a protrusion, and a pressurizing tool 17 and a base 11 having the same or smaller size as that of an LSI chip 15 are used. Accordingly, even if the tool 17 and the base 1 are deformed at the time of pressurizing, no distortion and deformation are applied to the chip 5. Thus, even if the strength of a connecting resin is reduced at the time of high temperature or moisture absorption, the chip 5 is not separated to enhance its reliability, thereby eliminating the variation in the element characteristics and the damage of the chip 5 and improving the yield.
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