| 摘要 |
PURPOSE:To obtain excellent moisture resistance by coating alkyl silicate on a semiconductor element and lead wirings, seizing them at 100 deg.C or higher, then aluminum-chelating them, and sealing with composition of epoxy resin and phenol novolac resin. CONSTITUTION:Alkyl silicate such as methyl silicate, methyl isopropyl silicate is dissolved in solvent such as benzene, coated on an element and lead wirings, and seized at 150-300 deg.C in N2. The film is preferably 5mum or less. It is treated with ethyl acetate aluminum diisopropylate, and sealed with resin. The sealing resin is incorporated with one or more of 2-functional epoxy compound such as diglycidyl ether of bisphenol A, and 3-functional epoxy compound such as triglycidyl ether of para-aminophenol in response to the utility, and fatty polyamine is used as a hardener and further various adding agents are mixed. According to this configuration, resin sealing with high moisture resistance reliability can be performed. |
