发明名称 PHENOLIC RESIN MOLDING MATERIAL
摘要 PURPOSE:To obtain the titled molding material having high thermal conductivity and excellent moisture resisting characteristics, by compounding calcined magnesium oxide, a mold-releasing agent, a colorant, a hardener, etc. CONSTITUTION:A phenolic resin is compounded with (A) 3-80wt.% (based on the whole material) filler consisting of calcined magnesium oxide calcined at >=1,200 deg.C and (B) a mold-releasing agent, a colorant and, if necessary, a hardener, etc.
申请公布号 JPS63227651(A) 申请公布日期 1988.09.21
申请号 JP19870060481 申请日期 1987.03.16
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KURASHIKI TOSHIRO
分类号 C08L61/06;C08K3/22;C08L61/04 主分类号 C08L61/06
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