| 发明名称 |
Epoxy adhesive film for electronic applications. |
| 摘要 |
<p>An adhesive composition which is particularly suitable for use as a die-attach adhesive. The adhesive composition comprises the reaction product of an admixture of an effective amount of a phenoxy resin, at least one epoxy resin and a fluorene curative.</p> |
| 申请公布号 |
EP0283134(A2) |
申请公布日期 |
1988.09.21 |
| 申请号 |
EP19880301326 |
申请日期 |
1988.02.17 |
| 申请人 |
MINNESOTA MINING AND MANUFACTURING COMPANY |
发明人 |
SCHENZ, JAMES L. C/O MINNESOTA MINING AND |
| 分类号 |
C08G59/50;C08L63/00;C09J7/00;C09J163/00;C09J171/00;C09J171/10;H01L21/58 |
主分类号 |
C08G59/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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