| 摘要 |
PURPOSE:To obtain a package where a high-density mounting operation is realized and whose versatility is high by installing the following: a first circuit board which contains a connecting part to mount a surface-mounting component and a first through hole to be electrically connected to the connecting part; a second circuit board which contains a conductor pin to be electrically connected to other circuit boards or the like and a second through hole to be electrically connected to the pin. CONSTITUTION:The following are installed: a first circuit board 10 which contains connecting parts 11, formed on the surface side, to mount surface-mounting components 40 and first through holes 12 to be electrically connected to the connecting parts 11; a second circuit board 20 which contains conductor pins 23, installed on the rear side, to be electrically connected to other circuit boards or the like and second through holes 22 to be electrically connected to the conductor pins 23. In addition, a conductor layer 30 is installed in such a way that it is laid between said first and second circuit boards 10, 20 and that the first through holes 12 on the side of the first circuit board 10 are connected electrically to the second through holes 22 on the side of the second circuit board 20 by means of the layer. For example, if the conductor layer 30 is formed in the form of a prescribed pattern, said connecting parts 11 correspond to said conductor pins 23 one by one via the first and the second through holes 12, 22. |
