| 摘要 |
PURPOSE:To prevent the peeling of even a light sensitive resin layer, by melting away a protection film from the surface of a dry photoresist film at the same time when the dry photoresist film is developed. CONSTITUTION:A protecting film 4 is formed on a semiconductor substrate 1 on which an electrode 3 is formed. An opening part is provided in the protecting film 4. A conductor layer 5 is formed on the opening part and the protecting film 4. A dry photoresist film 6 having a protecting film 8 is stuck to the surface of the conductor layer 5. The resist film 6 is exposed. The resist film 6 at the exposed part is developed to melt away. A metal bump 9 is formed on the conductor layer 5 at a part where the resist film 6 is melted away. The remaining resist film 6 and the unnecessary conductor layer 5 are removed. At this time, the film 8, which is present on the surface of the resist film 6 is melted away at the approximately same time when the resist film 6 is developed. Therefore, even light sensitive resin is not peeled off.
|
