| 摘要 |
PURPOSE:To shorten a bonding wire and to prevent short-circuit defects, by crossing the tip of each inner lead with a semiconductor chip at the lower part of an insulating supporting plate, and extending and turning the tip to the position of a bonding pad on the other side. CONSTITUTION:The tip parts of third, sixth, eleventh and fourteenth lead pins P3, P6, P11 and P14 of a lead frame 10 are drawn out to the short sides in a case 11; thus, the tip parts are extended to the positions of bonding pads BP of a semiconductor chip 13. The chip 13 is fixed to the draw-out parts R through an insulating film 12. Thus a bonding wire becomes short, and short circuit defects are prevented.
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