| 摘要 |
A semiconductor device includes a radiation plate (4), first and second conductive patterns (6a, 6b) formed on one surface of the radiation plate (4), a first semiconductor element (7a) fixed on and connected to the first conductive pattern (6a), a second semiconductor element (7b) fixed on and connected to the second conductive pattern (6b), a conductive member for connecting the first and second semiconductor elements (7a, 7b) to each other, a first external terminal (12b) electrically connected to the first conductive pattern (6a), a second external terminal (18) electrically connected to the second conductive pattern (6b), a third external terminal (10) electrically connected to the conductive member, and an outer casing (11), which is filled with epoxy resin, for enclosing the semiconductor elements (7a, 7b) and the first to third external terminals (12b, 18, 10). Part of each of the first to third external terminals is exposed to an exterior of the casing (11). At least one of the conductive member, first external terminal, second external terminal, and third external terminal includes a hollow fuse (101). |
