| 摘要 |
PURPOSE:To increase the number of power source lines which are connected between a LSI tester and probes of a probe card so as to suppress fluctuation in power source voltage, by using unused pads during package mounting as power source pads during a P/N process in a semiconductor integrated circuit device or the like of a master slice system. CONSTITUTION:The number of power source lines during a P/W process is more increased rather than essentially. The more unused pads exist during package mounting, the more the number of power source lines can be increased by using these unused pads as power sources during the P/W process. Therefore, when probes of a probe card are made respectively in contact with the power source pads, which are increased as power source probes, during the P/W process, an impedance between the power source pads and the LSI tester connected with the probes of the probe card is decreased so that fluctuation in power source voltage can be suppressed. |
