发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To fix a needle for a probe for observing a signal easily, and to reduce damage by electrically connecting a pad consisting of a conductive layer formed to another layer through one layer or more of insulating layers in a needle-erecting pad section for observing the signal and the needle-erecting pad section for observing the signal by a contact hole shaped to the insulating layers. CONSTITUTION:Pads 7, 8 composed of conductive layers formed to lower sections through one layer or more of insulating layers in needle-erecting pad sections 4, 5 for observing signals shaped on their midways of wiring conductors 1-3 as internal signal lines are connected electrically in the recessed sections of contact holes 9, 10 formed to the insulating layers. A needle 20 for a probe for observing the signals intrudes into the recessed sections of the contact holes 9, 10, and is easy to be fixed. Since the lower layer pads 7, 8 made up of the conductive layers are shaped into the recessed sections of the contact holes 9, 10, the conductive layer in a section where the needle 20 for the probe for observing the signals at the time of the evaluation of device characteristics is thickened, thus reducing damage due to the needle for the probe for observing the signals, then erecting the needle several times.
申请公布号 JPS63220539(A) 申请公布日期 1988.09.13
申请号 JP19870054628 申请日期 1987.03.09
申请人 NEC IC MICROCOMPUT SYST LTD 发明人 SONODA SACHIYO;NAGAMINE HISASHI
分类号 H01L21/66;H01L21/3205;H01L23/52 主分类号 H01L21/66
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