| 摘要 |
An integrated circuit devicer package includes a rigid frame and flexible tape assembly having wire leads between the die attach pad, conductive lead fingers, and the I.C. chip. A dam structure prevents resin flow to ensure proper wire bonding and a wedge prevents electrical shorting. A recognition pattern enables precise wire bonding. A epoxy molding compound is interposed in cavities formed in a Kapton layer to preclude delamination.
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