| 摘要 |
PURPOSE:To make it possible to embed electronic component parts at almost the central part of sheathing body in correct postures by a method wherein the electronic component parts are arranged between molds, on the inside of each of which projections are provided, and after that, sheathing material under plastic state is charged between the molds and hardened. CONSTITUTION:Molds 15 and 15 for molding sheathing body 14 consists of separate molds, i.e. a top force 15 and a bottom force 15, at the corresponding positions of which projections 16 and 16 are provided. The distance between the projections 16 and 16 under the state that the forces 15 and 15 are assembled each other corresponds to the diameter of an electronic component part 11. The top and bottom forces 15 and 15 are assembled each other so as to arrange the electronic component pats 11, 11, and a capacitor 18 within the molds and to clamp the electronic components 11, 11 between the projections 16, 16 from both sides of each component. Further, both terminal parts 13a, 13a of a lead wire 13 and the lead wire 19 of the capacitor 18 are fixed between the molds 15, 15 under clamping. Under the above-mentioned state, blank material (a) for sheathing molding under plastic state such as resin under molten state, green rubber or the like is charged in the forces 15, 15 so as to harden it in order to form the desired sheathing body 14. |
