| 摘要 |
PURPOSE:To improve an adhesive agent in its heat conduction for the prevention of heat generating parts from heat-caused deterioration by a method wherein a material excellent in heat conductivity is added to the adhesive agent participating in the heat-dissipation structure. CONSTITUTION:Silicone adhesive agents 5 and 14 replace solder between the heat-dissipation elements 2-4 and heat-dissipation fins 6 and between a thickfilm substrate 9 mounted with parts 7 and 8 and the heat-dissipation fins 6. To improve heat conductivity, aluminum nitride (AlN) or silicon carbide (SiC) powder, which is a material equipped with an excellent insulating feature and high heat conductivity, is added to the silicone adhesive agents 5 and 14. In this way, an excellent heat-dissipation capability is attained, and cooling is effectively accomplished of heat-generating parts. |
