METHOD OF PREPARING SUBSTRATE SURFACE FOR ELECTROLESS PLATING

摘要

Prepn. of printed wiring board involves treating board having circuitry pattern on it with a polymetallic catalysing agent bath including a deposition-enhancing metal selected from Ni and/or Co, and a sec. metal selected from Sn, Mo and Cu and/or W; the bath also includes an ester complex of a polyhydric cpd. The bath enhances subsequent overplating onto the circuitry pattern. Treatment lasts long enough to nucleate the surface of the pattern but not to give a generally continuous plating film. Treatment is followed by aq. rinsing. The obtd. preferentially catalysed wiring board is then overplating with Ni or Co (or their polyalloys).