LASER BEAM MACHINING AND TREATING METHOD AND ITS DEVICE

摘要

PURPOSE:To perform the laser beam machining and plating-treatment by changing an oscillation waveform of a laser beam to a normal pulse waveform or a continuous oscillation waveform and a Q switch pulse oscillation waveform to project it on an object to be treated immersed in an electroless plating liquid. CONSTITUTION:A main controller 10 sends a machining and treating change control signal R to a Q switch driver 9 and sends an ON control signal W to a laser power source 11. A laser beam oscillator 8 oscillates the pulse-like laser beam with a high Q value and the laser beam is projected on a ceramics substrate 4 and a through hole is machined and formed. A groove is machined and formed by moving a machining chamber 1 in either axial direction of the X or Y axial direction by an XY table 14. The main controller 10 sends the machining and treating change control signal R showing the plating-treatment to the driver Q and the oscillation waveform of the laser beam is formed to the continuous oscillation waveform. The electroless plating liquid is reacted on the surface of the ceramics substrate 4 on which the laser beam with the continuous oscillation waveform is projected to perform the plating-treatment.