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发明名称
Full panel electronic packaging structure and method of making same
摘要
申请公布号
US4766670(A)
申请公布日期
1988.08.30
申请号
US19870009981
申请日期
1987.02.02
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
GAZDIK, CHARLES E.;MCBRIDE, DONALD G.;SERAPHIM, DONALD P.;TOOLE, PATRICK A.
分类号
H01L21/60;H01L23/538;H01L25/04;H01L25/065;H01L25/18;(IPC1-7):H05K3/34
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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