发明名称 LEAD FRAME
摘要 PURPOSE:To prevent the deformation of a dam when a package is molded and to prevent the deformation of inner leads and outer leads accompanied by said deformation, by linking supporting pieces to the dam, thereby supporting the dam against pushing force of a molding material at the time of package molding. CONSTITUTION:Supporting pieces 10 are linked to a dam 6 so as to prevent the deformation of the dam 6 when a package is molded. Therefore, even if the tips of outer leads 5 are not connected to an outer frame 7, the pushing force of a molding material, which is applied to the dam 6 at the time of package molding, can be sufficiently supported because the supporting pieces 10 are linked to the dam 6. Since the dam 6 is not deformed by the pushing force of the molding material, the deformation and the like of the outer leads 5 accompanied by the deformation of the dam 6 are avoided beforehand.
申请公布号 JPS63208257(A) 申请公布日期 1988.08.29
申请号 JP19870040268 申请日期 1987.02.25
申请人 HITACHI LTD 发明人 OKADA SUMIO;SHIMIZU KAZUO;HOSHI AKIRO
分类号 H01L23/50 主分类号 H01L23/50
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