| 摘要 |
1,082,319. Semi-conductor devices. WESTERN ELECTRIC CO. Inc. Oct. 14, 1964 [Dec. 17, 1963; Feb. 25, 1964; Aug. 7, 1964], No. 8614/67. Divided out of 1,082,317. Heading H1K. An integrated circuit consists of an array of substrate bodies (e.g. of semi-conductor material, though a thin-film circuit in which the substrate is of carbon or ceramic material is also envisaged), the bodies being joined by a pattern of metal contacts which extend substantially in one plane over the surfaces of the bodies and provide bridges between them. The bridging portions are of sufficient thickness to provide the only mechanical support necessary to maintain the bodies in their appropriate relative positions in the array. Each separate body may contain one or more elements of the circuit. The elements of the circuit are first formed (e.g. by conventional diffusion techniques) in a single substrate member and metallic deposits 117, 118 &c. are then laid down to provide the interconnections between the various elements. Such deposits may consist of sequentially deposited " active " and " contact " metals as described in Specification 1,082,317. The portions of these deposits which will ultimately provide the bridges 119, 120 &c. between the separate bodies are then built up by further deposition, e.g. to a thickness of 100,000 Š as against 1000 to 5000 Š for the deposits elsewhere. The electrode portion (the initial deposits) may be of platinum on titanium and the thickening produced by masked deposition of gold. The substrate material underlying the bridging portions is then removed, e.g. by etching with wax masking-though mechanical abrasion or ionic bombardment are also mentioned in this connection. |
