| 摘要 |
PURPOSE:To prevent many fine leads from adhering by dipping an intermediate film carrier product in a plating bath, applying a vibration thereto, and then plating them. CONSTITUTION:The upper surface of a metal foil and the lower surface of a plastic tape are coated with photoresist by a plastic tape to which the foil is bonded. a fingerlike lead pattern is exposed to be formed, developed, and etched. remaining photoresist is dissolved and separated by a solvent to prepare a film carrier intermediate product. This product is dipped in a plating bath, and a vibration is immediately applied thereto. Then, adhered fingerlike leads are separated from each other, and can be arranged at an interval. Thereafter, when they are plated, the leads are plated one by one without adhering. A method of applying the vibration to the product is conducted by an ultrasonic wave radiation, a mechanical vibration or an impact, etc., and the ultrasonic wave radiation is most preferable. Thus, the product having many fine leads can be plated.
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