| 摘要 |
<p>PURPOSE:To prevent a thermal stress from being exerted on a semiconductor device and so on during a resin molding process by a method wherein, at a pin-grid array package, the semiconductor device and a bonding wire are resin- molded in such a way that a hollow part is left at the circumference of the semiconductor device and the bonding wire. CONSTITUTION:A semiconductor device 2 is fixed to a substrate 1; a bonding wire 3 is connected to a conductor circuit 4. The semiconductor device 2, the substrate 1 and the conductor circuit 4 are housed in a metal case 10. A protruding part 14 formed at the metal case 10 is fixed, via an adhesion layer 7a, to an insulating layer 5 formed on the conductor circuit 4. By this setup, a hollow part 13 which isolates the semiconductor device 2 and the bonding wire 3 is formed. A resin 7 is filled into the case 10 while the hollow part 13 is kept as it is. In this way, a thermal stress is not exerted on the semiconductor device 2 and the bonding wire 3 during a resin molding process accordingly, it is possible to prevent a chip from being cracked, thereby to prevent the wire from being cut.</p> |
