INTEGRATED CIRCUIT PACKAGE ASSEMBLY

摘要

An integrated circuit package assembly (22) includes a semiconductor chip (10) mounted on a die pad (12), having wire leads (18) attached to bond pads (20) on the chip and lead fingers (16) connected to the wire leads and external connections. A flexible and compressible tape (24) is attached to the bottom of the die pad and extends to the lead fingers to reduce stress and to minimize cracking of the package material that encloses the chip and the wire leads during vapor phase. An optional soft gel (28) is added to coat the chip surface including the bonds to further reduce chip surface stress.