| 摘要 |
A method for the preparation of reactive metal surfaces whereby the finished surfaces are in a reactive, essentially reduced condition and controlled oxidation reactions are employed to chemically bond a film on the metal surface to protect the surface or to provide a selected surface characteristic. During preparation the surface is covered by a working fluid that is inert with respect to the metal being worked and which is a solvent for film forming molecules which are being applied to the surface. The film forming molecules are thus readily chemically bonded to the reactive metal under controlled conditions essentially simultaneously with surface preparation to form a chemically uniform film on the reactive metal surface. The film is thus formed in the absence substances which may also react with the substrate metal to form undesirable reaction by-products which interfere with creation of a uniform, chemically bonded film on the substrate and which can result in pitting of the metal surface. The working fluid comprises a solvent for film forming monomers which is inert with respect to the metal being finished and may include halogenated liquid hydrocarbons and water as the solvent. Among the materials used to form the films of the method of the present invention good results have been achieved with hydroxyl and carboxyl terminated perfluoroalkylpolyethers. In addition inorganic film forming molecules such as phosphates, sulfates or chromates are used where water is the solvent for the working fluid. Articles produced by the method of the invention are claimed. |
