| 摘要 |
PURPOSE:To prevent any sensing resin scraps from sticking on the surface of substrate by a method wherein the wall of cup C feeding the solution dispersing from a turning semiconductor substrate to a liquid discharge port has an inner and cuter double structure while multiple holes are made in the inner wall of structure. CONSTITUTION:The wall of cup C feeding solution dispersing from a substrate 1 to a liquid discharge port 7 is inner and outer double structured; multiple holes 10 are made in the inner wall 9; and exhaust ports 11 are connected to the space between the outer wall 5 and the inner wall 9. The solution dispersed from the semiconductor substrate 1 is sticked on the inner wall 9 of cup C but to be sucked in and exhausted through the holes 10 made in the inner wall 9 and the exhaust ports 11 connected to the space between the inner wall 5 and the outer wall 9. Through these procedures, sensing resin scraps shall not be deposited on the inner wall 5 of cup C naturally not to be sticked on the substrate 1.
|
