发明名称 METHOD AND APPARATUS FOR INCREASING BREAKDOWN OF PLANAR JUNCTION
摘要 A semiconductor device has a substrate with regions (54, 56) of first and second conductivity types forming a junction (58) extending to a surface (60) of the substrate, an oxide layer (66, 68) on the surface and covering the junction and a charged ion region in the oxide layer extending from adjacent the junction at the surface of the substrate over part of the region (54) of first conductivity type, the polarity of the ions in the ion region being that of the region of first conductivity type, whereby the breakdown voltage of the device is increased.
申请公布号 JPS63204759(A) 申请公布日期 1988.08.24
申请号 JP19880031966 申请日期 1988.02.16
申请人 SILICONIX INC 发明人 RICHIYAADO EI BURANCHIYAADO;ADORIAN AI KOOGAN
分类号 H01L29/41;H01L29/06;H01L29/40;H01L29/861 主分类号 H01L29/41
代理机构 代理人
主权项
地址