| 摘要 |
PURPOSE:To enable any foreign particle to be removed completely by a method wherein adhesive rubber rollers are used to remove the foreign particle adhering to the package surface of semiconductor devices. CONSTITUTION:A low adhesive rubber roller 2 is brought into contact with the package surface of semiconductor device 1 running on the rail of manufactur ing device of semiconductor devices to suck up the foreign particles adhering to the package surface. Next, a high adhesive rubber roller 3 is brought into contact with the rubber roller 2 to collect the sucked up foreign particles. Through these procedures, the foreign particles adhering to the package surface of semiconductor devices can be removed without fail by means of using the adhesive rollers so that the removed foreign particles may be kept clean not to be scattered to the wind.
|
