| 摘要 |
PURPOSE:To develop a Cu alloy excellent in strength, electric conductivity, high-temp. creep characteristics, and resistance to peeling in a soldered zone and suitable for relay and switch materials, by incorporating specific amounts of Mg and P to Cu. CONSTITUTION:As the material for relay and switch, the Cu alloy containing, by weight, 0.3-1.5% Mg and 0.001-0.1% P is used. Since this Cu alloy has characteristics excellent in strength, electric conductivity, high-temp. creep characteristics, and resistance to peeling in a soldered zone, the Cu alloy suitable for relay and switch can be inexpensively manufacture at a low cost without using expensive Ni and Be unlike conventional Cu alloys. |
