| 摘要 |
<p>PURPOSE:To reduce the number of dust particles adhering to the rear of a wafer from a belt by a method wherein protruding parts are formed on the belt for wafer transport use and the contact area between the rear of the wafer and the belt is reduced. CONSTITUTION:Hemisphere-shaped protruding parts 4, 4... are formed in rows along the lengthwise direction on the surface of a flat belt 1. The belt 1 is set over two pulleys 2, 2 and is fed in one direction by the rotation of the pulleys 2. If wafer 3 is placed on the belt 1, the wafer 3 is supported by the protruding parts 4 at the belt; accordingly, the contact area between the rear of the wafer and the belt is reduced. By this setup, it is possible to reduce the number of dust particles which adhere to the rear of the wafer 3 from the belt 1.</p> |
