| 摘要 |
PURPOSE:To obtain a wafer supporter, in which superposed wafers can be arranged when the wafers are taken into or out of a furnace so that the adhesive properties of the wafers are improved, by constituting the wafer supporter of a quartz board, to which a hole having a diameter slightly larger than the wafers for placing the wafers is formed, and a quartz bar for holding down the wafers. CONSTITUTION:Another wafer 8 aiming at bonding with a wafer 7 is superposed onto the wafer 7, on which a PSG film, an SOG film etc., are affixed previously, through an attached film, and heat treated at a high temperature. A wafer supporter supporting superposed wafers 7, 8 at a time when the superposed wafers 7, 8 are inserted into a high temperature furnace in the manufacturing process of such a semiconductor device is constituted of a quartz board 1, to which a hole 2 having a diameter slightly larger than the wafers 7, 8 for positioning said wafers 7, 8 is shaped, and a quartz bar 3 for holding down the wafers 7, 8. The quartz board 1 having the bottom, to which the hole 2 such as a spot facing 2 having a diameter slightly larger than the wafers 7, 8 is shaped, the quartz bar 3, quartz struts 6 and a ceiling- section quartz board 4 to which a hole 5 through which the quartz bar 3 is passed is bored are mounted. |
