DIE BONDING DEVICE,申请号JP19870032860-传众专利搜索

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法人/股东/高管

发明名称	DIE BONDING DEVICE
摘要
申请公布号	JPS63199435(A)	申请公布日期	1988.08.17
申请号	JP19870032860	申请日期	1987.02.16
申请人	TOSHIBA CORP;IWATE TOSHIBA ELECTRON KK	发明人	IZAWA NOBORU;TAKAHASHI SHINOBU
分类号	H01L21/52;B23K3/06	主分类号	H01L21/52
代理机构		代理人
主权项
地址

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