发明名称 MANUFACTURE OF RESIN SEAL TYPE ELECTRONIC PART
摘要 PURPOSE:To obtain a shape, in which there is no abnormality in an electronic element and a connecting section, in a short molding time by injecting a resin by high pressure, changing over the pressure of injection to low pressure immediately before the completion of the filling, changing over the pressure of molding and injection of the resin to low pressure from high pressure and molding the resin. CONSTITUTION:A resin material is injected by high pressure until a molding die is filled completely with the resin material-that is, in its filling process, and the pressure is changed over to low pressure immediately before the completion of the filling. That is, the pressure of injection is lowered up to a secondary pressure curve D immediately before C in the figure, in which the inner pressure of an internal resin pressure curve B rises slowly with molding time and the material is filled, slightly before C. Accordingly, the pressure of injection progresses at comparatively low pressure after C where pressure is applied to the electric element, the deformation and damage of the electric element are prevented while burr generated in the molding die is also reduced by the low pressure molding, and molding time can further be shortened largely.
申请公布号 JPS59125633(A) 申请公布日期 1984.07.20
申请号 JP19830000853 申请日期 1983.01.06
申请人 MATSUSHITA DENKO KK;MATSUSHITA DENKI SANGYO KK 发明人 SHIOTANI YASUHIRO;SAWADA RIYOUJI
分类号 B29C67/00;B29C45/00;B29C45/14;B29C61/00;H01L21/56 主分类号 B29C67/00
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