| 摘要 |
A substrate for wiring an electrical component with an external circuit, comprises a base plate for accommodating the electrical component therein, a first insulation layer made of an organic material formed on the base plate, a first wiring formed on the first insulating layer, a second insulation layer made of an organic material formed on the first wiring, a second wiring formed on the second insulation layer, the second wiring being coupled to the electrical component, the base plate, the first insulation layer, the first wiring, and the second insulation layer being bent at the marginal edges thereof, in which portions of the first wiring on the bent portions are made of a material having a low temperature of recrystallization.
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