摘要 |
PURPOSE:To simplify a door opening/closing mechanism, and to decrease the number of its components by providing a means for opening and closing the door of an opening part for carrying out and carrying in a substrate by an external signal. CONSTITUTION:In a dust-proof container housing the substrate of a reticle, a photomask or a wafer, etc., for manufacturing a semiconductor circuit such as an LSI, etc., a door 5 covering so as to seal hermetically and opening part for carrying in and carrying out a substrate 10 can be opened and closed by an external signal. As for an opening and closing mechanism of the door 5, a spring member 6 energized in the direction for always closing the door 5, and a shape memory alloy 16, etc., deformed in the direction for opening the spring member 6 are used, and by allowing a current to flow to this shape memory alloy 16, etc., and varying its shape, the door 5 may be opened. In such a way, by providing the opening and closing mechanism on the side of the dust-proof container for containing the substrate 10, the generation of dust is prevented, and also, the number of components constituting the opening and closing mechanism is decreased. |