发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To obtain the titled novel composition, containing short fibers treated with a titanate based coupling agent, a polyfunctional epoxy compound, phenolic novolak resin, etc., and having excellent mechanical strength, crack, heat and moisture resistance. CONSTITUTION:A composition consisting of (A) short fibers (preferably aromatic polyamide fibers) treated with a titanate based coupling agent (e.g. isopropyl triisostearoyl titanate, etc.), (B) a polyfunctional epoxy compound (preferably novolak based epoxy resin), (C) a phenolic novolak resin, (D) an inorganic filler (e.g. crystalline silica powder, etc.) and (E) a curing accelerator (e.g. 2- methylimidazole, etc.). Furtheremore, the amount of the blended short fibers is preferably 1-7wt.% based on the total weight of the components (A), (B) and (C).
申请公布号 JPS63193915(A) 申请公布日期 1988.08.11
申请号 JP19870026577 申请日期 1987.02.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJIMOTO TAKAMITSU;KANEGAE YUZO;KITA SHUICHI;SHINODA ATSUKO;MORIWAKI NORIMOTO
分类号 C08J5/04;C08G59/00;C08G59/18;C08G59/62;C08K3/00;C08K9/02;C08L63/00;H01L23/29;H01L23/31 主分类号 C08J5/04
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