发明名称 DAMPING MATERIAL COMPOSITIONS AND DAMPING MATERIALS
摘要 <p>A first damping material composition comprises (a-1) an epoxy resin, (b) a curing agent, and (c-1) a liquid polymer having in one molecule on the average 1.6 or more of at least one functional group selected from among carboxyl, acid anhydride, amino, amido, and mercapto groups capable of reacting with epoxy groups of the epoxy resin and having a glass transition point of up to 0°C. A second damping material composition comprises (a-2) an epoxy resin of polyglycidyl ether with polyol or its polymer, (b) a curing agent, and (c-2) an aromatic hydrocarbon, a phenol or polymer containing at least one of them as main component and having a softening point of up to 25°C. A third damping material composition comprises (I) an epoxy resin obtained by adding (c-3) a cyclic ester to (a-3) a bisphenol type epoxy resin in a weight ratio of (c-3) to (a-3) of 20/80 to 98/2, and (b) a curing agent. The equivalent ratio (b)/(I) of (I) said epoxy resin to (b) said curing agent is in the range of 0.6 to 1.4.</p>
申请公布号 WO1988005802(P1) 申请公布日期 1988.08.11
申请号 JP1988000076 申请日期 1988.01.29
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